随着电子设备日益微型化和集成化,热仿真已成为其设计中的关键因素.电子封装模块的热仿真通常使用传统的有限元法FEM(finite element method),存在计算效率和精度之间的矛盾,在处理大变形问题和网格畸变方面也容易造成计算不收敛,从而导致结果错误.针对该问题,提出一种基于光滑粒子动力学SPH(smoothed particle hydrodynamics)算法的电子封装模块热仿真系统.该算法基于无网格拉格朗日数值方法,通过将热仿真对象离散为1组粒子的方式求解热传导方程,从而准确地预测电子封装模块的传热与散热,无需生成并处理大量的微小网格,不用担心网格失真等问题.SPH相对于FEM,仿真精度误差保持在1％～2％,仿真效率可提升近30倍,适合用于复杂和动态系统的模拟仿真.
Abstract
As electronic devices continue to miniaturize and integrate, thermal simulation has become a critical factor during the design phase. The conventional finite element method(FEM) used for the thermal simulation of electron-ics packaging modules faces a trade-off between computational efficiency and accuracy, and it also encounters difficul-ties in handling problems of large deformation and grid distortion, which will cause errors in the results. In this paper, a thermal simulation system for electronics packaging modules based on the smoothed particle hydrodynamics(SPH) algo-rithm is proposed. The SPH algorithm is based on the meshless Lagrange numerical method, and it resolves the heat conduction equation by discretizing the simulation object into a set of particles, thus accurately predicting the heat con-duction and heat dissipation in electronics packaging modules. Since it does not need to generate a large number of mi-cro-meshes, there is no grid distortion. Compared with FEM, the SPH algorithm achieves an accuracy error between 1％ and 2％, thereby improving the simulation efficiency by approximately 30 times. Therefore, this algorithm is highly suit-able in simulating the thermal behavior of a dynamical system with a complex structure.
关键词
电子封装/有限元仿真/光滑粒子动力学/传热方程
Key words
Electronics packaging/finite element simulation/smoothed particle hydrodynamics(SPH)/heat conduction equation
维普
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