Enhancing the power density of vehicle-grade power modules is of significance for the performance of electric vehicles. The two-dimensional layout used in conventional power modules results in large parasitic inductance, which limits the switching speed and bus voltage and further affects the increase in power density. To solve this problem, an IGBT power module with EconoDUAL packaging was taken as the research object, and a three-dimensional layout was designed using the stacked DBC method to develop a 1200 V/1200 A IGBT power module. The layout structure of the proposed power module was introduced in detail. Compared with those obtained using the conventional two-dimensional layout methods, the parasitic inductance decreased by 58％. Additionally, electrical performance tests including a double-pulse test with pulse current of 1200 A under bus voltage of 800 V were conducted on the power module, thereby verifying the improved power density of the module. To maintain the heat dissipation performance while increasing the power density,a water-cooled PinFin heatsink was used at the bottom of the power module, and heat dissipation simulation and thermal resistance test were carried out, revealing an IGBT thermal resistance of 0.084 K/W and a diode thermal resistance of 0.124 K/W. These results show no significant difference compared with a commercially available 1200 V/900 A module with the same packaging, confirming the correctness and effectiveness of the proposed design approach.
关键词
功率模块/电动汽车/IGBT功率模块/杂散电感/热阻
Key words
Power module/electric vehicle/IGBT/parasitic inductance/thermal resistance
万方数据