针对晶体管外壳(TO)封装元器件在单板设计中的高可靠性要求，以及成型难度大、成型钳不易操作等问题，对 TO 封装元器件成型过程的机理与操作进行分析并设计简易成型工装，经实际操作验证进一步优化工装设计。结果表明，工装成型方法可靠、成型质量高、成型操作简单、成型效率高且工艺稳定性好，能够很好地应用于印制电路板生产过程中TO封装器件的成型。
High reliablity molding process optimization and tool design for transistor outline package components
In view of high reliablity requirements for transistor outline package components in printed circuit board design processing,the difficulties of molding,difficult operation of molding tools,this paper analyzes the mechanism and optimized after practical operation.The results show that the TO package components molding method is reliable,the molding quality is high,the molding operation is simple,the molding efficiency is high,and the process stability is good.It can be well applied to the molding of TO package components in PCB production.
TO package componentsdevice moldingprocess optimizationtooling design
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