现代电子装联工艺技术的展望
Outlook on Modern Electronic Assembly Technology
曹德 1陈雨柔 1宋朵朵1
作者信息
- 1. 中国航空工业集团公司西安航空工业计算技术研究所,陕西 710076
- 折叠
摘要
阐述电子装联工艺技术的特点,针对电子装联工艺技术现状,探讨现代电子装联工艺技术,以及系统的设计与实现,包括装联材料和工艺的选用.展望现代电子装联工艺技术的发展趋势.
Abstract
This paper expounds the characteristics of electronic assembly process technology,explores modern electronic assembly process technology,as well as the design and implementation of the system,including the selection of assembly materials and processes,in response to the current situation of electronic assembly process technology.It looks forward to the development trend of modern electronic assembly technology.
关键词
电子装联/工艺技术/材料选用Key words
electronic assembly/process technology/material selection引用本文复制引用
出版年
2024
NETL
NSTL
万方数据