电子技术2024,Vol.53Issue(3) :1-3.

基于半绝缘SiC衬底GaN HEMT体陷阱的效应分析

Analysis of GaN HEMT Bulk Trap Effect Based on Semi Insulating SiC Substrate

牛梓戌
电子技术2024,Vol.53Issue(3) :1-3.

基于半绝缘SiC衬底GaN HEMT体陷阱的效应分析

Analysis of GaN HEMT Bulk Trap Effect Based on Semi Insulating SiC Substrate

牛梓戌1
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作者信息

  • 1. 浙江大学电气工程学院,浙江 310027
  • 折叠

摘要

阐述采用背栅测试来表征GaN-on-SiC HEMT的体陷阱效应,过程中分别表现出两段式特征,分别对应Ⅲ族氮化物缓冲层以及半绝缘SiC衬底的加压过程.另外在Silvaco TCAD平台搭建相应的物理模型,仿真体陷阱效应以及在不同衬底电压下的电势分布.

Abstract

This paper describes the use of back gate testing to characterize the volume trap effect of GaN on SiC HEMT,which exhibits a two-stage characteristic corresponding to the pressurization process of the Ⅲ nitride buffer layer and semi insulating SiC substrate.In addition,a corresponding physical model is built on the Silvaco TCAD platform to simulate the volume trap effect and potential distribution under different substrate voltages.

关键词

GaN/HEMTs/半绝缘SiC衬底/背栅测试/体陷阱效应建模/电流坍塌/外延优化

Key words

GaN HEMTs/semi insulating SiC substrates/back gate testing/volume trap effect modeling/current collapse/epitaxial optimization

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出版年

2024
电子技术
上海市电子学会,上海市通信学会

电子技术

影响因子:0.296
ISSN:1000-0755
参考文献量4
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