This paper describes the complex manufacturing process of integrated circuit chips.In the manufacturing of 12 inch chips,there are usually hundreds or even thousands of steps in the process,which can be divided into pre process and post packaging process.The Pad process is located at the end of the previous process,and its main function is to connect with the pins of the subsequent process.Therefore,starting from the process mechanism,it explores the causes and improvements of Pad Crystal in integrated circuits through experiments,proposes rework methods after Pad Crystal occurrence,and has been practically applied.
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