电子技术2024,Vol.53Issue(6) :316-317.

基于高温环境的集成电路可靠性测试方法分析

Analysis of Integrated Circuit Reliability Testing Method Based on High Temperature Environment

杨婷
电子技术2024,Vol.53Issue(6) :316-317.

基于高温环境的集成电路可靠性测试方法分析

Analysis of Integrated Circuit Reliability Testing Method Based on High Temperature Environment

杨婷1
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作者信息

  • 1. 中国电子科技集团公司第五十四研究所,河北 050081
  • 折叠

摘要

阐述高温环境下的集成电路可靠性测试方法.通过分析不同温度条件下的电路性能变化,提出一种基于加速寿命测试的可靠性评估方法.利用该方法,可以在较短时间内模拟长期高温环境对集成电路的影响,从而有效评估其可靠性.

Abstract

This paper expounds the reliability testing methods for integrated circuits in high-temperature environments.A reliability evaluation method based on accelerated life testing is proposed by analyzing the changes in circuit performance under different temperature conditions.By using this method,it is possible to simulate the impact of long-term high-temperature environments on integrated circuits in a relatively short period of time,thereby effectively evaluating their reliability.

关键词

集成电路/可靠性测试/高温环境

Key words

integrated circuits/reliability testing/high temperature environment

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出版年

2024
电子技术
上海市电子学会,上海市通信学会

电子技术

影响因子:0.296
ISSN:1000-0755
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