电子技术2024,Vol.53Issue(8) :38-39.

塑封器件声学扫描(SAM)中的特殊结构判断分析

Analysis of Special Structures in Acoustic Scanning(SAM)of Plastic Encapsulated Devices

聂延伟
电子技术2024,Vol.53Issue(8) :38-39.

塑封器件声学扫描(SAM)中的特殊结构判断分析

Analysis of Special Structures in Acoustic Scanning(SAM)of Plastic Encapsulated Devices

聂延伟1
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作者信息

  • 1. 西安西谷微电子有限公司,陕西 710077
  • 折叠

摘要

阐述声学扫描显微镜检查是检测塑封器件内部分层的最佳检测手段.介绍声学扫描显微镜检查的原理、封装塑封器件分层的识别方法.针对塑封器件芯片表面不规则涂覆层误判问题,提出验证方法.

Abstract

This paper describes that acoustic scanning microscopy is the best detection method for detecting internal delamination in plastic encapsulated devices.It introduces the principle of acoustic scanning microscopy inspection and the identification method of delamination in encapsulated plastic devices.It proposes a verification method for the misjudgment problem of irregular coating layers on the surface of plastic encapsulated device chips.

关键词

集成电路/声学扫描检查/特殊结构/塑封器件

Key words

integrated circuits/SAM/special structures/plastic encapsulated devices

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出版年

2024
电子技术
上海市电子学会,上海市通信学会

电子技术

影响因子:0.296
ISSN:1000-0755
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