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太赫兹低损耗金刚石-无氧铜输能窗研究

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首次开展太赫兹金刚石-无氧铜盒型输能窗研究,利用低损耗的无氧铜材料代替传统可伐合金材料,显著降低输能窗传输损耗、提高器件输出功率.为降低无氧铜与金刚石热膨胀系数严重不匹配造成的封接应力,提出一种多槽应力释放结构,将金刚石表面封接应力由 210 MPa减小至 50 MPa,小于金刚石与无氧铜组合抗拉件的平均封接强度 116.2 MPa.根据设计结果,开展金刚石-无氧铜输能窗封接试验,氦漏率≤1×10-11(Pa·m3)/s,实现了气密封接.测试金刚石-无氧铜输能窗传输损耗为 0.7 dB,比采用金刚石-可伐输能窗的传输损耗减小 2 dB,即输出功率可以提高 60%,为研制大功率太赫兹源奠定了重要关键技术基础.
Study on Terahertz Low Loss Diamond-OFHC RF Window
In order to decrease the transfer loss of RF window and improve the output power of terahertz vacuum electronic devices,dia-mond-oxygen free high conductance copper(OFHC)pill-box RF window in terahertz regime is studied for the first time.A multi-slot structure is proposed to reduce the sealing stress which is caused by the mismatch of the thermal expansion coefficient between diamond and OFHC.The simulation predicts that the multi-slot structure reduces sealing stress from 210 MPa to 50 MPa,which is lower than the average sealing strength of diamond-OFHC tensile piece.After the sealing experiment,the RF window is proved to be airtight with a he-lium leak rate lower than 1×10-11(Pa·m3)/s.The measurement result shows that the diamond-OFHC RF window is 2 dB less transfer loss than diamond-Kovar RF window,which means that the output power is increased by 60%.This research settles an essential techno-logical foundation for developing high power terahertz resource.

terahertzpill-box RF windowdiamondoxygen free high conductance coppermulti-slot structure

张琳、蔡军、潘攀、冯进军

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北京真空电子技术研究所微波电真空器件国家重点实验室,北京 100015

太赫兹 盒型输能窗 金刚石 无氧铜 多槽应力释放结构

2024

电子器件
东南大学

电子器件

CSTPCD
影响因子:0.569
ISSN:1005-9490
年,卷(期):2024.47(2)
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