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一种低暗电流红外光敏晶体管理论与工艺研究

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针对现有红外光敏晶体管芯片 125℃高温下暗电流超过 1 mA/mm2,无法胜任高温场景应用难题,开展了红外光敏晶体管暗电流影响因子研究.通过在结构上增加浓硼区注入设计和工艺上降低材料外延电阻率,获得了常温下暗电流小于1 nA/mm2、125℃高温下小于 10 μA/mm2 的高性能红外光敏晶体管芯片,显著降低了芯片暗电流,使高温应用变得可能.
Theoretical and Process Study of a Low Dark Current Infrared Phototransistor
The existing infrared phototransistor chip has a dark current of more than 1 mA/mm2 at 125 degrees,which is not suitable for high temperature application.Targeting at this problem,a study on the influence factor of the dark current of infrared phototransistor is carried out.High-performance infrared phototransistor chips with dark current less than 1 nA/mm2 at room temperature and less than 10 μA/mm2 at 125 degrees are obtained by adding dense boron zone injection in structure and reducing epitaxial resistivity in process,which significantly reduces the dark current of the chip,and makes high temperature applications possible.

infrared phototransistordark currenthigh temperatureconcentrated boronresistivity

陈培仓、徐阳、张铮、史良旭、王涛、吴建伟

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无锡中微晶园电子有限公司,江苏 无锡 214035

红外光敏晶体管 暗电流 高温 浓硼 电阻率

2024

电子器件
东南大学

电子器件

CSTPCD
影响因子:0.569
ISSN:1005-9490
年,卷(期):2024.47(6)