With the continuous improvement of chip preparation process,semiconductor integrated circuits are being developed toward miniaturization and integration,which brings new challenges to the near-field microwave imaging technology.In this paper,a probe-sample three-dimensional electromagnetic coupling model was established.The electromagnetic interaction between probe tip and sample was investigated using finite element numerical analysis.Scanning microwave imaging of the surface structure of Si-based chip was performed at different probe-sample spacings.Imaging result were consistent with simulation result.The sensitivity and resolution of the scanning microwave test system decreased as the tip-sample spacing increased.It is of great significance for the improvement and industrialization of scanning microwave microscopy developed from the combination of atomic force microscopy and microwave measurement technology.
关键词
扫描微波显微镜/有限元法/电磁建模/针尖-样品间距
Key words
scanning microwave microscope/finite element method/electromagnetic modeling/needle tip sample spacing
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