电子元件与材料2024,Vol.43Issue(1) :67-72.DOI:10.14106/j.cnki.1001-2028.2024.1286

具有多晶阻挡层的浮空P区IGBT开关特性研究

Switching characteristics of floating P-base IGBT with poly barrier layers

肖蝶 冯全源
电子元件与材料2024,Vol.43Issue(1) :67-72.DOI:10.14106/j.cnki.1001-2028.2024.1286

具有多晶阻挡层的浮空P区IGBT开关特性研究

Switching characteristics of floating P-base IGBT with poly barrier layers

肖蝶 1冯全源1
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作者信息

  • 1. 西南交通大学 微电子研究所, 四川 成都 611756
  • 折叠

摘要

为了减少浮空P区IGBT结构的栅极空穴积累,改善结构的电磁干扰(EMI)噪声问题,从而提高结构电磁干扰噪声与开启损耗(Eon)之间的折中关系,研究提出了一种具有多晶硅阻挡层的FD-IGBT结构.新结构在传统结构的浮空P区上方引入一块多晶硅阻挡层,阻挡层接栅极,形成与N型漂移区的电势差.新结构在器件开启过程中,多晶硅阻挡层下方会积累空穴,导致栅极附近积累的空穴数量减少,从而降低浮空P区对栅极的反向充电电流.通过TCAD软件仿真结果表明,相比于传统FD-IGBT,新结构开启瞬态的过冲电流(ICE)和过冲电压(VGE)的峰值分别下降 26.5%和 8.6%,且在栅极电阻(Rg)增加时有更好的电流电压可控性;相同开启损耗下,新结构的dICE/dt、dVCE/dt和dVKA/dt最大值分别降低 26.5%,15.1%和 26.1%.

Abstract

To reduce hole accumulation and electromagnetic interference(EMI)noise in floating P-base IGBT structure,a FD-IGBT structure was proposed with poly barrier layer,which improved the trade-off relationship between the EMI and turn-on loss(Eon).The new structure has a poly barrier layer connected to the gate over the floating P-base,which results in a potential difference between the poly barrier layer and the drift region.The holes can be accumulated under the poly barrier layer at the turn-on state,which decreases accumulated holes near the gate and the reverse charge current from the floating P-base to the gate.Compared with conventional FD-IGBT,the simulation results by TCAD software show that the peak overshoot current(ICE)and overshoot voltage(VGE)for the new FD-IGBT structure are reduced by 26.5%and 8.6%,respectively.Moreover,better controllability on current and voltage is improved at higher gate resistance(Rg).For the same turn-on loss,the maximum values of dICE/dt,dVCE/dt and dVKA/dt of the new FD-IGBT are reduced by 26.5%,15.1%and 26.1%,respectively.

关键词

电磁干扰噪声/开启损耗/浮空P区/多晶硅阻挡层/栅极反向充电电流

Key words

electromagnetic interference noise/turn-on energy losses/floating P-base/poly barrier layer/gate reverse charge current

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基金项目

国家自然科学基金(62090012)

四川省重点研发项目(2023YFG0004)

出版年

2024
电子元件与材料
中国电子学会 中国电子元件行业协会 国营第715厂(成都宏明电子股份有限公司)

电子元件与材料

CSTPCD北大核心
影响因子:0.491
ISSN:1001-2028
参考文献量17
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