High precision equivalent circuit model for via-hole transition structure in multilayer LCP substrate
As an excellent millimeter-wave packaging material, Liquid Crystal Polymer ( LCP) is widely used in millimeter-wave high-density system integrated circuit design. In multilayer circuit systems, via-holes, as the core circuit units, can realize the interconnection between different layers of devices and transmission lines, which effectively reduces the circuit size and improves the transmission efficiency. In this article, a high-precision intrinsic equivalent circuit model of via-hole was proposed to address the problems of low accuracy and long-time consumption in the traditional interconnection structure modeling methods. The model analyzes the effect of the power/ground plane on the transmission characteristics of the via-hole, considers the parasitic effect by electromagnetic mode conversion, and optimizes the traditional π-type equivalent circuit model. Based on the intrinsic equivalent circuit model of the via-hole, the equivalent circuit of the via-hole transition structure was constructed by combining the microwave cascade method. By 4-layer LCP package substrate technology, the grounded coplanar waveguide to strip line to grounded coplanar waveguide ( GCPW-SL-GCPW) via-hole transition structure circuit boards were fabricated and tested. The results show that the equivalent circuit simulation results, full-wave simulation results, and measured results are highly consistent, verifying the high-precision equivalent circuit model.
LCPvia-hole transition structureintrinsic equivalent circuit model of via-holeelectromagnetic mode conversion
万方数据
维普
