Failure analysis of IGBT modules under thermal,vibration and thermal vibration coupling effects
To address the failure problem of IGBT modules for power devices under multiple field loads,the model of IGBT module was designed and constructed.Finite element simulation software was used to conduct thermal cycling,random vibration,and thermal vibration coupling tests on the IGBT modules.The distribution patterns and failure modes of three module failure positions were compared and analyzed under three different load conditions.The results show that the maximum stress is 226.84 MPa under thermal cycling load,which appears in the center of the lower surface of the DBC welding layer.In the random vibration load,the maximum stress value is 0.0023 MPa,which occurs at the edges and corners of the lower surface of the DBC welding layer.In the thermal vibration coupling load,the maximum stress value is 377 MPa,which occurs on the surface of the DBC welding layer near the center and surrounding corners.Under the condition of thermal vibration coupling,the mechanical behavior of the module welding layer changes,and the average stress of each structure of the module increases by 50.11％.The research results provide a reference for the analysis of the response characteristics of power device IGBT modules under various loads,and also provide a theoretical basis for the design of module structures.
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