Preparation and properties of high-performance high-temperature conductive adhesive based on finite element analysis
To address the bottleneck of conductive adhesive matrix for heat intolerance,cyanate ester was selected as the matrix for their high-temperature resistance,low moisture absorption rate,and good thermal stability.And silver was used as the conductive filler.Using APP developer function in COMSOL finite element simulation software,code was imported for randomly distributed conductive particle to establish simulation model,and the shape and size effect of conductive filler particles were explored in more detail for the new conductive adhesive.Compared with silver spheres,the simulated conductivity is better for silver sheet filled conductive adhesive.When the mass fraction of silver reaches 90%,the resistivity of silver sheet filled conductive adhesive is 3 orders of magnitude lower than that of silver sphere filled conductive adhesive.According to simulation results,silver flakes filled conductive adhesive was prepared using flake silver powders as filler,bismaleimide as tougheners,and dibutyltin dilaurate as acuring agent.The resistivity is gradually reduced at higher silver sheet content,which then rapidly drops to 43.9 mΩ·cm and becomes plateau at filler mass fraction of 50%-60%.The conductive adhesive has shear strength of above 15 MPa and can withstand high temperature of 300℃.
conductive adhesivehigh temperature resistanceCOMSOLcyanatessilver
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