首页|热循环条件下BGA叠层焊点可靠性研究及参数优化

热循环条件下BGA叠层焊点可靠性研究及参数优化

扫码查看
原文链接
  • 国家科技期刊平台
  • NETL
  • NSTL
  • 万方数据
构建叠层焊点最优结构参数,提高BGA叠层焊点热循环条件下的可靠性具有重要的意义.建立有限元模型,分析叠层焊点在热循环条件下应力应变,运用田口正交法和曲面响应法,将焊点的高度、直径、间距、阵列作为实验设计的变量,关键焊点最大等效塑性应变作为优化目标.结果表明:焊点阵列对优化目标的影响权重最大,优化后的BGA叠层焊点结构参数如下,田口正交法:单层焊点高度为0.38 mm,焊点间距为0.55 mm,焊点直径为0.44 mm,焊点阵列为8×8;曲面响应法:单层焊点高度为0.387 mm,焊点间距为0.573 mm,焊点直径为0.446 mm,焊点阵列为8×8.对优化前后的寿命进行预测,优化后的叠层焊点寿命约是优化前的3.75倍.
Reliability study and parameter optimization of BGA laminated solder joints under thermal cycling conditions
It is of great significance to construct optimal structural parameters for laminated solder joints and improve their reliability under thermal cycling conditions.A finite element model was established to analyze the stress and strain of the laminated solder joints under thermal cycling conditions.Using Taguchi orthogonal method and response surface methodology,the maximum equivalent plastic strain of the critical solder joints was optimized by setting variables such as height,diameter,spacing,and array of the solder joints for the experimental design.The results show that the solder joint array has the greatest impact on optimization objective.The optimized structural parameters for the BGA laminated solder joints are given as follows.For Taguchi orthogonal method,the optimized single joint height,spacing,diameter are 0.38 mm,0.55 mm,and 0.44 mm respectively with array of 8x8.For response surface methodology,the optimized single joint height,spacing and diameter are 0.387 mm,0.573 mm,0.446 mm respectively with array of 8×8.The lifetime was predicted before and after optimization.The lifetime of the optimized stacked solder joints is approximately 3.75 times that of the unoptimized ones.

finite element methodexperimental designthermal cyclingBGA double-stacked solder jointsparameter optimization

朱淼、杨雪霞、孙艳玺、王则、邢学刚

展开 >

太原科技大学应用科学学院,山西太原 030024

有限元法 实验设计 热循环 BGA叠层焊点 参数优化

国家自然科学基金山西省自然科学基金山西省自然科学基金山西省自然科学基金

116021572021030212322020220302121230320210302124389

2024

10.14106/j.cnki.1001-2028.2024.1481

电子元件与材料
中国电子学会　中国电子元件行业协会　国营第715厂(成都宏明电子股份有限公司)

电子元件与材料

CSTPCD北大核心
影响因子：0.491
ISSN：1001-2028
年,卷(期)：2024.43(7)