In order to disclose the mechanism of the influence of AlN substrate surface condition on the peeling strength of AlN-AMB substrate,the surface microstructure of the lapping type and fired type AlN substrates and the microstructure of interface reaction layer,cross section and fault of AlN-AMB substrates prepared by them were analyzed. The results show that the surface of the fired AlN substrate is compact and flat,and the interface reaction layer of the AlN-AMB substrate prepared by the fired AlN substrate is compact and flat. The fault is located in the AlN matrix,and the plastic deformation of Cu is obvious,the peeling strength is up to 19.053 N/mm. Whereas,there are microcracks and granular grains on the surface of the lapping AlN substrate. The reaction layer of the AlN-AMB substrate prepared by the lapping AlN substrate is uneven and discontinuous,the solder penetrates into the microcracks in the subsurface of the AlN substrate,which is easy to induce stress concentration. The fault is located in the subsurface of the AlN substrate. The plastic deformation of Cu is small,and the peeling strength is as low as 5.789 N/mm.
关键词
氮化铝基板/AlN-AMB/活性金属钎焊/显微组织/剥离强度
Key words
AlN substrate/AlN-AMB/active metal brazing/microstructure/peeling strength
维普
万方数据