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太赫兹波化合物半导体材料研究进展

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继微波、毫米波技术之后,太赫兹(THz)波技术已被证实在下一代探测与通信领域具有重要的应用前景.作为微波、毫米波芯片衬底材料主流的Ⅲ-Ⅴ族化合物半导体材料,正逐渐成为太赫兹单片集成电路(TMIC)材料科学的研究热点.本文介绍了以砷化镓(GaAs)、磷化铟(InP)、氮化镓(GaN)为代表的化合物半导体材料在TMIC制造领域的研究与应用进展,分析了国内外研究现状与未来发展趋势.
Development of compound semiconductor materials at terahertz wave band
Following microwave and millimeter wave technologies,terahertz(THz)wave technology has been proven to have important application prospects in the next generation of detection and communication fields.As the mainstream substrate material for the microwave and millimeter wave chips,Ⅲ-Ⅴ compound semiconductor materials becomes the research hotspot in THz monolithic integrated circuit(TMIC)material science.In this article,the recent research,and application progress of compound semiconductor materials represented by Gallium Arsenide(GaAs),Indium Phosphide(InP),and Gallium Nitride(GaN)in the field of TMIC manufacturing are introduced,and the current situation and future development trends are analyzed domestically and internationally.

terahertzcompound semiconductorreviewintegrated circuitsolid-state technology

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常州工学院计算机信息工程学院,江苏常州 213032

太赫兹 化合物半导体 综述 集成电路 固态技术

2024

电子元件与材料
中国电子学会 中国电子元件行业协会 国营第715厂(成都宏明电子股份有限公司)

电子元件与材料

CSTPCD北大核心
影响因子:0.491
ISSN:1001-2028
年,卷(期):2024.43(10)