In three-dimensional(3D)integrated circuits,through-via interconnects are pivotal for layer-to-layer packaging and connectivity,which is critical for breaking through the traditional two-dimensional integrated circuit layout.Lately,through glass via(TGV)technology has garnered significant interest from researchers and manufacturers due to its compelling benefits,such as low cost,superior performance,easy fabrication,and diverse applicability.This article first gives an in-depth review of the TGV technology on the performance merits,process specificities,manufacturing methods,and key technologies.Subsequently,it summarizes the burgeoning applications of the TGV technology in 3D integrated electronic packaging,encompassing 3D Integrated Passive Devices(IPD),integrated antenna packaging,Micro-Electro-Mechanical Systems(MEMS),and multi-chip module packaging.Finally,the future development directions and applications of the TGV technology in 3D integrated electronic packaging are further prospected.
维普
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