Design and optimization of embeddable metallized glass-based microchannel heat sink
With the rapid advancement of glass encapsulation technology,its limitations in thermal management have become increasingly evident,presenting a critical technical bottleneck in need of urgent resolution.This study explored the integration of metallization strategies into glass-based microchannel heat sinks to enhance thermal conductivity.An optimized partitioned metallization design was proposed to improve localized cooling performance further.A metallized glass microchannel heat sink model was developed,and thermal simulations were conducted to evaluate its thermal conductivity and dissipation efficiency.Results indicate that incorporating high-thermal-conductivity metallized glass into the microchannel heat sink reduces thermal resistance from 11.71 W/K to 1.80 W/K.This significant improvement highlights the potential of this approach as a novel solution for thermal management in glass packaging technology.
万方数据
维普
