Research on bonding life prediction method of copper wire in plastic devices under temperature cycle condition
To investigate the failure modes resulting from temperature cycling,the LM2902DGR4 encapsulated device,a type of operational amplifier,was selected as the research object.The temperature cycling simulation was conducted by using Solidworks modeling and ANSYS finite element simulation software.The simulation results were analyzed using temperature contour mapping,maximum principal stress contour mapping,equivalent stress contour mapping,and total deformation contour mapping.Comprehensive analysis reveals that the failure mode of the copper wire bond under temperature cycling conditions is a fracture at the copper lead neck,and the equivalent stress is from 52.551 MPa to 87.302 MPa.Using the Engelmaier model,the calculated pre-cycle failure count of the copper wire bond is 119901 cycles under temperatures cycle between-40 ℃ and 125 ℃.The lifespan predication method was proposed for the copper wire bonds using a finite element simulation method,which provides the basis for the lifespan assessment of this device in practical engineering applications.
encapsulated componentscopper wire bondingtemperature cyclingfinite element simulationlife prediction
万方数据
维普
