With the development of electronic manufacturing industry,LGA package is increasingly used in various electronic products more.Because of its flat structure and no pre-solder perform,it is very easy to cause the solder joint voids to be very large after reflow soldering,which affects the reliability of soldering.LGA solder void hollow in all mounting components is relatively difficult to control,how to reduce the LGA soldering voids has become one of the current problems in the SMT industry.The influence of different process methods on voids and how to optimize the welding process to reduce voids in LGA components are mainly discussed from the three aspects of the use of differ-ent solder paste,different steel mesh holes and different reflow welding curve.
关键词
栅格阵列封装/钢网开孔/炉温曲线/空洞/焊接工艺
Key words
LGA/stencil apertures/reflow profile/void/welding process
维普
万方数据