Research on the Ceramic Packages for High Temperature Environments
The application fields of high-temperature electronic devices and research progress of ceramic package for high temperature packaging is introduced,and the high-temperature performance of traditional ceramic packages is studied.Research results indicate that the materials and metallization systems of traditional ceramic packages will un-dergo significant changes in high-temperature environments.The parasitic parameters of ceramic packages will in-crease with the increase of the ambient temperature.Prolonged exposure to high temperatures also leads to oxidation and discoloration of the gold layer of the shell,delamination between the gold layer and ceramic,formation of bub-bles,and even shedding.These issues prevent the ceramic packages from meeting the requirements of high-tem-perature environments.Therefore,it is necessary to develop a new metallization system and a compatible material sys-tem to solve the technical problem that the existing ceramic shell can not be used in high temperature environment.
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维普
