PCBA板上元器件失效分析方法研究
Research on Failure Analysis Method for Component on PCBA Board
马勇 1张少华 1何静 1林晓会1
作者信息
- 1. 中国电子科技集团公司第五十八研究所,江苏无锡 214035
- 折叠
摘要
针对印刷电路板组件上(PCBA)上元器件失效分析难度大、流程复杂和效率不高等问题,通过理论与案例相结合的方式,提出了一种PCBA板上元器件失效分析方法.按照"先非破坏性后破坏性、先外部后内部"的思路,通过元器件在板测试、拆机测试和开封分析等方法,提出了一种板上元器件失效分析流程,进一步提升了板上元器件失效分析的效率,为PCBA板上元器件产品更新迭代和高效率分析使用提供了参考.
Abstract
Aiming at the great difficulty,complex process and low efficiency of failure analysis of component on PCBA board,a failure analysis method of component on PCBA board is proposed through a combination of theory and case.Following the approach of"non-destructive before destructive,external before internal",a failure analysis process for on-board components is proposed through methods such as component on board testing,disassembly testing,and open package analysis,which further improves the efficiency of on-board component failure analysis and pro-vides a reference for the iteration and efficient analysis and use of PCBA component products.
关键词
印刷电路板组件/元器件/失效分析方法/非破坏性分析/破坏性分析/在板测试/拆机测试/开封分析Key words
PCBA/component/failure analysis methods/non-destructive analysis/destructive analysis/on-board test/disassembly test/open package analysis引用本文复制引用
出版年
2024
NETL
NSTL
维普
万方数据