Verification Method for Assembly Process Adaptability of CBGA Components
A systemic verification process and method for assembly process adaptability of ceramic ball grid array packaging (CBGA) components is designed, and this method is applied to a CBGA component. By conducting the assembly process adaptability verification on the CBGA component, the risk of solder joint cracking under temperature cycling stress is effectively identified. The cracking of the solder joint is mainly due to the difference in thermal expan-sion coefficient between the component body and the PCB board. In the environment of alternating temperature change, solder joint crack due to thermal mechanical fatigue stress. This issue can be effectively improved by apply-ing dispensing process on the CBGA component or using column grid array packaging (CCGA) .
ceramic ball grid arrayassembly process adaptabilitythermal fatigue
万方数据
维普
