Analysis of PCB Control Methods Based on Surplus Problem
The factors that cause the surplus in the production and manufacturing process of PCB, the impact of sur-plus on the electrical performance of finished PCBs, and the impact of surplus on PCB during the welding and de-bugging of PCBs and other electronic assembly products in the later process are discussed. Guided by the effects of PCB residues on product performance in the three states of core board processing inspection, finished light board in-spection, welding, debugging and assembly inspection in the later process of production of PCB, the analysis based on the actual case is carried out, the causes of surplus and their impact on finished boards and subsequent related products are analyzed, and improvement measures for the process methods and product quality control requirements of PCBs are proposed.
万方数据
维普
