Research on Structural Reliability Design of Ceramic Package for Microsystem Packaging
Due to the large number of integrated chips,high density,and high reliability requirements of microsys-tems,most microsystems adopt ceramic package with high package density,good thermal performance,and good airtightness,as well as the integrated design of packaging shell and substrate,which greatly saves layout space. As the carrier of microsystems,the structural reliability of ceramic package plays a crucial role in the performance of mi-crosystems. Therefore,based on the high-density multi-layer co-fired ceramic technology system,finite element analysis software is used to conduct a systematic simulation study on the structural reliability of microsystem shell,and structural design rules suitable for large-sized and highly reliable shell of microsystem package are formed. Microsys-tems designed using this design rules have advantages of high reliability,high density,high performance,low power consumption and short design cycles.
microsystemsmulti-layer co-fired ceramiccoefficient of thermal expansionstructural reliabilityfinite element analysissimulation
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