首页|MLCC手工焊接质量控制研究

MLCC手工焊接质量控制研究

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针对多层瓷介电容器(MLCC)在手工焊接过程中可能引入的裂纹损伤从而降低其使用可靠性的问题开展了研究.探索了手工焊接过程中MLCC外形尺寸、印制电路板(PCB)是否预热、焊盘散热速率和焊接温度对MLCC裂纹的影响程度,摸索最优焊接工艺参数,尽可能消除MLCC应用过程中可能引入裂纹损伤的质量隐患,进一步确保MLCC的使用可靠性.
Research on Quality Control of MLCC Manual Welding
The problem of the reduce of use reliability of multilayer ceramic capacitor (MLCC) due to possible crock damage during manual welding is studied. The influence of MLCC dimensions, PCB preheating, pad heat dissipation rate and welding temperature on the cracks of MLCC in the manual welding process is explored, and the optimal welding process parameters are explored, so as to eliminate quality hazards of possible crack damage in the appli-cation process of MLCC as much as possible, and further ensure its use reliability.

multilayer ceramic capacitormanual weldingwelding qualitydimensionpreheatingheat dissipation ratetemperatureoptimum technigue parameter

杜琳琳、李龙、金洪斌、韩汶洪、姚钰钰、徐琴

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成都宏科电子科技有限公司,四川成都610100

中国航空工业集团公司西安航空计算技术研究所,陕西西安710065

多层瓷介电容器 手工焊接 焊接质量 外形尺寸 预热 散热速率 温度 最优工艺参数

2024

电子质量
中国电子质量管理协会 信产部五所

电子质量

影响因子:0.146
ISSN:1003-0107
年,卷(期):2024.(7)