Effect of Thermal Field Distribution in High Temperature Laminating Machine on Properties of Microwave Substrate
The multi- physics simulation software COMSOL is used to simulate the thermal field distribution of the high temperature laminator and analyze the influence of different thermal fields on the performance of microwave substrate. According to theoretical prediction and experimental results, the position of heating tube of laminating machine is rea-sonably adjusted. After adjustment, the surface quality, relative dielectric constant uniformity and peel strength of the substrate are improved, and the surface folds of the substrate are eliminated. The relative dielectric constant uniformity Cv value reaches 0.0003 and the peel strength exceeds 2.4 N/mm. At the same time, the thickness of the substrate is stable and controllable, and the process capability index Cpk of the substrate thickness reaches 1.0. With the help of SPC technique and COMSOL software, the problems existing in the thermal field of high temperature laminating ma-chine are solved, the experimental cost is greatly reduced, and effective tools are provided for solving the problems encountered in actual production.
high temperature laminating machinethermal field distributionmicrowave dielectric substrateCOMSOLrelative dielectric constantstatistical process controlprocess capability index
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