The Application of Measuring System Capability Analysis in Peeling Strength Test
The copper clad laminate is the basic material of electronic products,which plays the role of component in-terconnection in the circuit. Its application determines that there must be a good bonding force between the copper foil and the medium layer of the copper clad laminate. The main quantitative index is the peeling strength,which has a fundamental impact on the quality of the copper clad laminate. However,the peeling strength test is a more complex and destructive test,which is affected by many factors such as copper foil thickness,dielectric layer composition and microscopic interface. And the destructive test process itself is difficult to evaluate the stability of the measurement system by standard samples. Therefore,it is very important to carry out the capability analysis of measuring system scientifically in the process of testing the peeling strength of copper clad laminate. By using professional data software to analyze the measuring capability Cg of the measuring tool,the reasons for the low ability of the measuring system are found out according to the level of each indicator,and the improvement of the measuring system is targeted to re-duce the test error and improve the accuracy of the measurement results,which provides a good basis for the im-provement direction of the peeling strength test of copper clad laminate.
measuring system capability analysiscopper clad laminatepeel strength
万方数据
维普
