电子质量2024,Issue(8) :30-35.DOI:10.3969/j.issn.1003-0107.2024.08.006

覆金属箔板样品制备方法研究

Research on the Preparation Method of Metal Clad Foil Board

史留学 刘立娜 董彦辉 李继爽 刘国龙 赵志鹏 刘巧会 于艺杰
电子质量2024,Issue(8) :30-35.DOI:10.3969/j.issn.1003-0107.2024.08.006

覆金属箔板样品制备方法研究

Research on the Preparation Method of Metal Clad Foil Board

史留学 1刘立娜 1董彦辉 1李继爽 1刘国龙 1赵志鹏 1刘巧会 1于艺杰1
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作者信息

  • 1. 中国电子科技集团公司第四十六研究所,天津 300220
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摘要

覆金属箔板是印制电路板最主要的基础材料之一,其性能指标对电子产品的使用有直接影响.其中,体积电阻率与表面电阻率是衡量覆金属箔板绝缘性能优劣的重要参数.为了减小样品制备工艺对试样体、表电阻率准确测试带来的影响,着重探讨了5种常见的工艺方法,热转印图形法制成的样品的电极尺寸精准、价格低廉且成功率高,在一般实验室也容易实现.经过对该方法制成的试样的体、表电阻率进行测试,分析测试结果,验证了该制样方法可靠、可行.

Abstract

Metal foil clad board is one of the most important basic materials for printed circuit boards,and its perfor-mance indicators have a direct impact on the use of electronic products. Volume resistivity and surface resistivity are important parameters for measuring the insulation performance of metal foil clad boards. In order to reduce the impact of sample preparation process on the accurate testing of sample volume resistivity and surface resistivity,five com-mon process methods are analyzed. The samples prepared by the heat transfer graphic method have the advantages of precise electrode size,low cost,and high success rate,which are also easy to achieve in general laboratories. After testing the volume resistivity and surface resistivity of the samples made by this method,and analyzing the test results,the reliability and feasibility of this method have been verified.

关键词

覆金属箔板/印刷电路板/体积电阻率/表面电阻率/三电极法

Key words

metal clad foil board/printed circuit board/volume resistivity/surface resistivity/three electrode method

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出版年

2024
电子质量
中国电子质量管理协会 信产部五所

电子质量

影响因子:0.146
ISSN:1003-0107
参考文献量7
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