With the wide application of plastic encapsulated integrated circuits in artificial intelligence,mobile Internet,Internet of Things,cloud computing,big data and other fields,it faces the demand for long-term power supply and continuous work,so it is necessary to study its long-term reliability. The influence factors of highly accelerated stress test (HAST) of plastic encapsulated integrated circuits are analyzed from the aspects of equipment,test hardware,wire material and so on. The analysis results show that the use of high-purity water and the optimization of temperature and humidity control procedures can avoid the failure of integrated circuit test caused by condensation. Conductive an-odic filament (CAF) and electrochemical migration (ECM) are common failure problems in HAST,and the test hardware and technology should be well controlled and prevented from CAF and ECM. The test wires affect HAST,and the insulation layer and core material of wires should be monitored regularly and replaced timely.
维普
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