In order to study the influence of residual thermal stress after packaging and welding of LTCC substrate,the thermal stress deformation of LTCC substrate under different temperature varying loads is simulated and tested. The results show that there is a certain deviation between the simulation results and the test results. Therefore,the fi-nite element model of LTCC welded components is modified. By optimizing the installation gap between LTCC sub-strate and aluminum alloy box and the thickness of solder layer,the simulation model of thermal deformation charac-teristics of LTCC welded components is modified. The flatness and thermal stress deformation simulation values ob-tained by using the modified LTCC welding module simulation model and the test measurement errors are less than 15％. The results show that the finite element modified simulation model of LTCC substrate welded components com-posed of LTCC substrate and aluminum alloy box is correct and feasible.
关键词
低温共烧陶瓷/热变形仿真/优化设计
Key words
low temperature co-fired ceramics/thermal deformation simulation/optimization simulation
维普
万方数据