Construction Analysis Methods and Case Studies of Plastic Packaging and Sealed Integrated Circuits
The technology of component construction analysis can effectively detect construction defects,design de-fects,and material selection flaws in components.It is an important means to improve the reliability of component,and an effective verification technology for component applications.Through the study of the construction characteris-tics of plastic packaging and sealed semiconductor integrated circuits,a method of construction analysis for domestic components is proposed,and the research on this method is carried out with typical cases.This method can effec-tively guide the construction analysis work of domestic components and improve the quality and reliability of domestic components.
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