电子质量2024,Issue(9) :28-35.DOI:10.3969/j.issn.1003-0107.2024.09.006

塑封和密封集成电路结构分析方法及案例研究

Construction Analysis Methods and Case Studies of Plastic Packaging and Sealed Integrated Circuits

胡凛 谢霞平 曹浩龙 付清轩
电子质量2024,Issue(9) :28-35.DOI:10.3969/j.issn.1003-0107.2024.09.006

塑封和密封集成电路结构分析方法及案例研究

Construction Analysis Methods and Case Studies of Plastic Packaging and Sealed Integrated Circuits

胡凛 1谢霞平 1曹浩龙 1付清轩2
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作者信息

  • 1. 工业和信息化部电子第五研究所,广东 广州 511370
  • 2. 美的集团工业技术事业群,广东 佛山 528000
  • 折叠

摘要

元器件结构分析技术能够有效地发现元器件中结构缺陷、设计缺陷和材料选用缺陷,是提升元器件可靠性的重要手段,是元器件应用的有效验证技术.通过对塑封和密封半导体集成电路的结构特点进行研究,提出了一种国产元器件结构分析方法,并以典型案例对该方法开展研究.该方法能够有效地指导国产元器件结构分析工作,提升国产元器件的质量和可靠性.

Abstract

The technology of component construction analysis can effectively detect construction defects,design de-fects,and material selection flaws in components.It is an important means to improve the reliability of component,and an effective verification technology for component applications.Through the study of the construction characteris-tics of plastic packaging and sealed semiconductor integrated circuits,a method of construction analysis for domestic components is proposed,and the research on this method is carried out with typical cases.This method can effec-tively guide the construction analysis work of domestic components and improve the quality and reliability of domestic components.

关键词

电子元器件/结构分析/塑封集成电路/密封集成电路/可靠性

Key words

electronic component/construction analysis/plastic packaging integrated circuit/sealed integrated circuit/reliability

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出版年

2024
电子质量
中国电子质量管理协会 信产部五所

电子质量

影响因子:0.146
ISSN:1003-0107
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