首页|高密度CQFN外壳的谐振抑制方法研究

高密度CQFN外壳的谐振抑制方法研究

扫码查看
基于全波电磁仿真软件分析了高密度陶瓷方形扁平无引线(CQFN)外壳的谐振问题.研究内容包括使用全波电磁仿真软件快速判断谐振频点的方法,以及在外壳外观结构不改变的基础上,通过调整内部结构来抑制谐振频点产生的方法.基于上述方法,研制了一款改进型DC~20 GHz频段内存在谐振频点的CQFN外壳,测试结果显示改进后的外壳在DC~20 GHz频段内的谐振频点都被抑制.测试结果与仿真结果具有较好的相符性,证明该分析方法可以用来解决CQFN外壳的谐振问题,也适用于各类表贴式高密度陶瓷封装外壳的谐振问题分析.
Research on the Suppression of Resonance in High-Density CQFN Packages
The resonance issue of the high-density ceramic quad flat no-lead (CQFN) shell is analyzed based on full-wave electromagnetic simulation software.The research content include the methods to quickly judge the reso-nance frequency point by using full-wave electromagnetic simulation software,and the methods to restrain the gener-ation of resonance frequency points by adjusting the internal structure without changing the outer structure of the package.Based on the above method,an improved CQFN shell with resonant frequency points in the DC~20 GHz band is developed.The test results indicate that the resonant frequency of the improved version is suppressed in the DC~20 GHz.There is strong consistency between testing results and simulation results,which proves that this analy-sis method can effectively address the resonance issue of CQFN packages,and it is also applicable for analyzing resonance problems in various surface-mounted high-density ceramic packages.

electromagnetic resonancesurface mount packagehigh densityhigh temperature co-fired ceramic

毕大鹏、余希猛、杨振涛、段强

展开 >

中国电子科技集团公司第十三研究所,河北 石家庄 050051

电磁谐振 表贴式外壳 高密度 高温共烧陶瓷

2024

电子质量
中国电子质量管理协会 信产部五所

电子质量

影响因子:0.146
ISSN:1003-0107
年,卷(期):2024.(9)