Main factors such as humidity,dew-point,breathing effect and their mechanism on the condensation phenomenon are introduced in detail.Based on the temperature cycling test of an electronic assembly,the links and root causes of condensation during the temperature cycle are discussed,and corresponding solutions are proposed.Results show that condensation problem always exists during the temperature cycling.Condensation occurs on the outer surface of the component during the heating stage while inside the component during the cooling stage.The root cause of the condensation problems is that the high humidity air environment causes a small condensation temperature difference,and condensation will occur when the temperature difference changes within a very small range.There-fore,the occurrence of condensation problems can be effectively avoided by reducing the relative humidity of air and slowing down the cooling rate.
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