Analysis of Gold/Nickel Miscible Failure of ENIG Welding Pad
Electroless Nikel/Immersion Gold(ENIG)process is widely used in PCB surface treatment due to its excel-lent flatness,weldability,conductivity,bonding properties,as well as the stability and resistance to oxidation of gold itself.However,due to the complex ENIG process and high requirements for PCB manufacturers,improper control can lead to various quality problems,among which gold layer insolubility and tin shrinkage are common issues.The gold/nickel interpenetration of ENIG solder pads in a PCB leads to poor soldering during the soldering process,which is manifested as gold insolubility and tin shrinkage.The failure mechanism of ENIG pad gold/nickel miscible in PCB is analyzed and demonstrated by means of optical microscope,field emission electron scanning microscope analysis,X-ray energy spectrum analysis,microslice technology,ion grinding technology and Auger electron spectrum analy-sis combined with nickel leaching mechanism.The prevention and control suggestions are given,which is of great sig-nificance to improve the quality and reliability of the pad.
Electroless Nickel/Immersion Golddewettinginter-diffusion of Au/Nigold does not dissolvefailure analysis
万方数据
维普
