高韧性和自修复的壳聚糖-聚丙烯酸-MXene导电水凝胶及其压力传感性能
High toughness and self-healing conductive hydrogels of chitosan-poly acrylic acid-MXene and capability for strain sensors
李泽宇 1邓夏玲 1韩威 1谢祖坤 1蔡少君 1彭湘红1
作者信息
- 1. 江汉大学 光电材料与技术学院,江汉大学光电化学材料与器件教育部重点实验室,武汉 430056
- 折叠
摘要
壳聚糖基导电水凝胶在电子皮肤、健康监测和柔性穿戴电子等领域得到广泛关注.本文将MXene分散到丙烯酸-壳聚糖水溶液中,丙烯酸原位聚合成聚丙烯酸,制备了壳聚糖-聚丙烯酸-MXene导电水凝胶(CS-PAA-MXene).CS-PAA-MXene具有优异的力学性能,其断裂应变为 1 450%,断裂应力为 0.6 MPa,韧性达到 2.6 MJ·m-3.CS-PAA-MXene能够粘附于多种物体表面,包括玻璃、塑料、橡胶、铜片和铝片等,其中对玻璃的最大剥离力可达到 175 N·m-1;CS-PAA-MXene具有优异的自修复性能,切断的CS-PAA-MXene相互接触 2.5 s后,其电阻恢复到切断前数值.CS-PAA-MXene应变传感器被成功用于检测人体各类活动,如手指、手肘和膝盖等关节弯曲活动.基于壳聚糖的阳离子电荷及其抗菌特性,CS-PAA-MXene将在自粘附和高延展的柔性传感器具有良好的应用前景.
Abstract
Chitosan-based conductive hydrogels have attracted extensive attention in electronic skins,human health monitoring,and flexible wearable sensors.In this work,MXene was dispersed in acrylic acid-chitosan solu-tion,and then the acrylic acid monomer was in situ polymerized to synthesis the chitosan-poly(acrylic acid)-MXene hydrogels(CS-PAA-MXene).CS-PAA-MXene shows excellent mechanical properties.The tensile strength of the CS-PAA-MXene is as high as 0.6 MPa,and its elongation at break and toughness reach 1 450%and 2.6 MJ·m-3,respectively.CS-PAA-MXene can adhere to various surfaces,including glass,plastic,rubber,copper and aluminum,etc.The maximum peeling force on the glass can reach 175 N·m-1.After the cut CS-PAA-MXene contacts each other for 2.5 s,its resistance value returns to the pre-cut value,suggesting CS-PAA-MXene has excellent self-healing performance.CS-PAA-MXene strain sensors have been successfully used to detect a wide range of human move-ments,such as the joint flexions of finger,elbow and knee.Due to the cationic charge and antibacterial properties of chitosan,CS-PAA-MXene conductive hydrogels will have a good application prospect in self-adhesive and high-extensibility flexible sensors.
关键词
壳聚糖/MXene/导电水凝胶/力学性能/应变传感器Key words
chitosan/MXene/conductive hydrogels/mechanical properties/strain sensor引用本文复制引用
基金项目
国家自然科学基金(52103213)
江汉大学项目(2021yb019)
出版年
2024