首页|CuO掺量对ZnO-B2O3-Bi2O3玻璃结构与热性能的影响

CuO掺量对ZnO-B2O3-Bi2O3玻璃结构与热性能的影响

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为了降低硼酸盐无铅封接玻璃的软化温度,研究了CuO掺量(0~15%,质量分数,下同)对40ZnO-30B2O3-30Bi2O3 玻璃结构及热性能的影响.结果表明,在950℃保温2 h的熔制工艺条件下,试验组成范围内均能形成均质玻璃.随着CuO掺量增加,ZnO-B2O3-Bi2O3 玻璃中的[BO3]/[BO4]结构单元比例先增大后减小,在CuO掺量为8%时达到最大值,此时[BO3]结构单元含量相对较多.当CuO掺量进一步增加,部分[BO3]逐渐向[BO4]转变.此外,随CuO掺量增加,玻璃化转变温度及析晶温度逐渐降低,在400~850℃范围质量损失速率逐渐减小,但15%高掺量时呈现质量增加的趋势.玻璃的平均线热膨胀系数(25~450℃)随CuO增多无明显变化,保持在7.10×10-6℃-1 左右.玻璃的软化温度和半球温度呈先降低后升高的趋势,当CuO掺量为8%时,软化温度和半球温度最低.
Effect of CuO Doping on the Structure and Thermal Properties of ZnO-B2O3-Bi2O3 Glass
In order to reduce the softening temperature of borate lead-free sealing glass,the effect of CuO doping(0-15%)on the structure and thermal properties of 40ZnO-30B2O3-30Bi2O3 glass was investigated.The results showed that homogeneous glass was formed in the range of test compositions under the melting process at 950℃for 2 h.With the increase of CuO doping,the ratio of[BO3]/[BO4]units in ZnO-B2O3-Bi2O3 glass system increased and then decreased,and reached the maximum at 8%CuO doping.The number of[BO3]units was relatively more at 8%CuO doping.With the further increase of CuO incorporation,it gradually transformed part of[BO3]to[BO4].Furthermore,the glass transition temperature and the crystallization temperature decreased gradually with the increase of CuO doping.The rate of mass loss decreased gradually at 400-850℃,but showed a trendency of increasing mass at 15%high doping.The thermal expansion coefficient of the glass(25-450℃)remained almost unchanged with the increase of CuO doping,and kept about 7.10×10-6℃-1.The softening temperature and hemispherical temperature of the glass showed a trendency of decreasing and then increasing,and the softening temperature and hemispherical temperature were the lowest when the CuO doping was 8%.

ZnO-B2O3-Bi2O3low melting point glassthermal expansion coefficientsoftening temperatureCuO

向婉婷、罗欣、江正迪、连启会、黄佳鑫、吴浪

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西南科技大学 材料与化学学院,四川 绵阳 621010

ZnO-B2O3-Bi2O3 低熔点玻璃 热膨胀系数 软化温度 CuO

国家自然科学基金

12375316

2024

非金属矿
苏州非金属矿工业设计研究院

非金属矿

CSTPCD
影响因子:0.636
ISSN:1000-8098
年,卷(期):2024.47(5)