碳钢表面置换铜镀层的生长机理及其耐蚀性
Growth Mechanism and Corrosion Resistance of Replacement Copper Coating on Carbon Steel Surface
刘明 1张昊 2苏剑英 3王梅丰 2王夏妍2
作者信息
- 1. 大庆石化建设有限公司,大庆 163000
- 2. 南昌航空大学材料科学与工程学院,南昌 330063
- 3. 哈尔滨飞机工业集团有限责任公司,哈尔滨 150000
- 折叠
摘要
采用自研的置换镀铜液,在20号碳钢表面制备了铜镀层.通过电化学测试,研究了置换镀铜时间对铜镀层耐蚀性的影响,并分析了铜镀层的生长规律.结果表明:随着置换镀铜时间的延长,铜镀层的自腐蚀电位正移,自腐蚀电流密度减小,电荷转移电阻(Rct)显著增大;当置换镀铜时间为16 h时,Rct值最大,铜镀层的耐蚀性最好;置换铜镀层的生长过程分为3个阶段,初期形成阻挡层和多孔层,中期形成阻挡层、致密层和多孔层,后期形成阻挡层和致密层.
Abstract
Copper coating was prepared on surface of the 20#carbon steel by self-developed displacement copper plating solution.The effect of replacement copper plating time on the corrosion resistance of copper coating was studied by electrochemical test,and the growth regulation of copper coating was analyzed.The results show that with the increase of replacement copper plating time,the free corrosion potential of the coating shifted positively,the free corrosion current density decreased,and the charge transfer resistance(Rct)increased significantly.When the replacement copper plating time was 16 h,Rct value was the largest,and the corrosion resistance of copper coating was the best.The growth of the replacement copper coating was divided into three stages.In the early stage,a barrier layer and a porous layer were formed.In the middle stage,a barrier layer,a dense layer and a porous layer were formed.In the later stage,a barrier layer and a dense layer were formed.
关键词
置换镀铜/20号碳钢/耐蚀性/电化学Key words
replacement copper plating/20#carbon steel/corrosion resistance/electrochemistry引用本文复制引用
出版年
2024
NETL
NSTL
万方数据