首页|甜高粱SdSWEET1a基因的表达与功能分析

甜高粱SdSWEET1a基因的表达与功能分析

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糖转运蛋白(SWEET)在植物生长发育过程中发挥重要作用.为了探究甜高粱(Sorghumdochna Forssk.Snowden)SWEET基因的功能,本研究从NCBI数据库中筛选得到了一个糖转运蛋白基因SdSWEET1a,利用PCR技术从甜高粱'海甜1号'中克隆得到该基因,并对其结构和功能进行初步探究.结果显示,SdSWEET1a基因CDS全长810 bp,编码269个氨基酸,含有6个跨膜螺旋.该基因编码的蛋白质二级结构包含4种构象,以无规则卷曲和α-螺旋为主.系统进化树分析表明SdSWEET1a与甘蔗SsSWEET1a的亲缘关系最近.表达模式分析发现,非生物胁迫会诱导SdSWEET1a基因在根、茎和叶中的表达.酵母功能互补试验显示Sd-SWEET1a 具有吸收半乳糖、葡萄糖、脱氧葡萄糖和蔗糖的能力.本研究通过对甜高粱SdSWEET1a的初步研究,有利于探究甜高粱SWEET基因应对非生物胁迫响应机理.
Expression and Functional Analysis of SdSWEET1a from Sweet Sorghum
Sugar transporter protein(SWEET)plays important roles in plant growth and development.In order to in-vestigate the function of SWEET genes in sweet sorghum[Sorghum dochna(Forssk.)Snowden],a sugar transporter gene SdSWEET1a was screened from the NCBI database and cloned from sweet sorghum'Haitian 1'by PCR method,and its structure and function were preliminarily explored.The results showed that SdSWEET1a gene was 810 bp in length,encoding 269 amino acids and containing six transmembrane helices.The secondary structure of the protein contains four conformations,mainly random coil and α-helix.Phylogenetic tree analysis showed that SdSWEET1a was most closely related to sugarcane SdSWEET1a.Expression pattern analysis revealed that abiotic stress induced SdSWEET1a expression in roots,stems and leaves.Yeast functional complementation assays showed that SdSWE-ET1a had the ability to absorb galactose,glucose,sucrose and 2-deoxy-D-glucose.This preliminary study of SdSWEET1a in sweet sorghum in benificial to explore the mechanism of SWEET gene response to abiotic stress in sweet sorghum.

Sweet sorghum[Sorghum dochna(Forssk.)Snowden]SWEET geneGalactoseAbiotic stress

潘成才、王太行、王宇、朱昆宇、江行玉、周扬

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海南大学热带作物学院,海南省耐盐作物生物技术重点实验室,海口,570228

海南大学园艺学院,海南省热带园艺作物品质调控重点实验室,海口,570228

甜高粱[Sorghum dochna(Forssk.)Snowden] SWEET基因 半乳糖 非生物胁迫

国家重点研发计划项目海南省基础与应用基础研究计划(自然科学领域)高层次人才项目国家自然科学基金海南大学科研启动项目

2018YFE0207203-22019RC04631660253KYQDZR1845

2024

10.13271/j.mpb.022.001767

分子植物育种
海南省生物工程协会

分子植物育种

CSTPCD北大核心
影响因子：0.765
ISSN：1672-416X
年,卷(期)：2024.22(6)
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