Flow and Heat Transfer Characteristics in Silicon-Based Pin-Fin Microchannels
Four kinds of silicon-based microchannels with different cylindrical pin-fin arrangements were designed and fabricated.Using water as the working fluid,the flow and heat transfer characteristics in different pin-fin microchannels were investigated experimentally.And the experimental data were also compared with those of the plain microchannel to analyze the mechanism of flow resistance increasement and heat transfer enhancement.The results showed that pin-fin arrays enhanced heat transfer coefficients obviously while increased flow resistances simultaneously.At lower Reynolds number,the resistance was mainly caused by the wall friction effect,while at relatively higher Reynolds number,the contribution of trailing vortex to the flow resistance became larger.Under the same conditions,larger friction factors and heat transfer coefficients were obtained in the staggered pin-fin microchannels than in the in-line pin-fin microchannels.Increasing the pin-fin arrangement density vertical to the flow direction,the heat transfer enhancement is more obvious.The staggered pin-fin microchannel with the most dense pin-fin arrangement has a higher overall heat transfer performance,with the thermal resistance reduction by an average of 53.4％ compared with the plain microchannel under the same pump power.
pin-fin arrayssilicon-based microchannelpin-fin arrangementflow resistanceenhanced heat transfer
NETL
NSTL
万方数据
维普
