Numerical Simulation of Flow Boiling Heat Transfer in Microchannel With a Single Microcolumn
The safe operation of high-power electronic chips highly requires high-efficiency heat dissipation techniques.Flow boiling heat transfer has received widespread attention due to the high heat transfer coefficient.To accurately simulate the complex two-phase process of flow boiling in a microchannel,a phase change model based on the volume of fluid(VOF)method with phase interface temperature correction is proposed in this paper.The flow boiling heat transfer process in a single microchannel with a single microcolumn is simulated to investigate the effects of heat flux and inlet subcooling by analyzing the evolution of two-phase flow process and temperature field.The results show that due to the local vapor coverage,there is a turning point of thermal resistance for flow boiling in microchannel under different working conditions,and high heat flux corresponds to higher bubble growth rate and nucleation area.A high subcooling will delay the turning point,but the overall thermal resistance will increase.
flow boiling heat transfermicrochannelvolume of fluid methodnumerical simulation
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