首页|TPMS空气热沉结构流动传热特性研究

TPMS空气热沉结构流动传热特性研究

扫码查看
采用CFD流固耦合数值模拟,以TPMS(三重周期性最小表面)结构为核心构建直流空间内芯片散热热沉.对比了同种条件下的Diamond,Gyroid,I-WP,Fischer-Koch和F-RD五种TPMS结构和同等孔隙率的传统翅片结构的温度场和流体的速度和压力场.构建无量纲局部性能评价指标对六种结构的冷却效果进行综合比较后表明,TPMS结构比常规翅片结构有16.6%~50.6%的性能提升,其中Fischer-Koch的散热能力最为突出,其在受限空间下有更大的散热潜力,内部流动换热比翅片结构的优势最高可达12倍.
Study on TPMS Air Heat Sink Structure Flow Heat Transfer Characteristics
A direct current chip heat sink with a Triply Periodic Minimal Surface(TPMS)struc-ture as the core was constructed using Computational Fluid Dynamics(CFD)fluid-solid coupling numerical simulation.The temperature field,fluid velocity,and pressure field of five TPMS struc-tures(Diamond,Gyroid,I-WP,Fischer-Koch,and F-RD)with the same conditions and a traditional fin structure with equivalent porosity were compared.A dimensionless local performance evaluation index was established to comprehensively compare the cooling effects of the six structures.The results indicated that TPMS structures exhibited a performance improvement of 16.6%to 50.6%compared to conventional fin structures.Among them,the Fischer-Koch structure demonstrated the most prominent heat dissipation capability,with greater cooling potential in constrained spaces.The internal flow heat transfer advantage of the Fischer-Koch structure was up to 12 times higher than that of the fin structure.

triply periodic minimal surfaceTPMSthermal managementfluid-solid coupling

王佳选、钱琛怿、俞彬彬、钟豪章、施骏业、陈江平

展开 >

上海交通大学制冷与低温工程研究所 上海 200240

上海交通大学材料改性与数值模拟研究所 上海 200240

三重周期性最小表面 芯片热沉 数值模拟 流固耦合

国家重点研发计划

2020YFA0711500

2024

工程热物理学报
中国工程热物理学会 中国科学院工程热物理研究所

工程热物理学报

CSTPCD北大核心
影响因子:0.4
ISSN:0253-231X
年,卷(期):2024.45(4)
  • 25