Enhanced Pool Boiling Heat Transfer of HFE-7100 on Ribbed Surface
As the heat generated by electronic components continues to increase,air-cooled heat dissipation can no longer meet the heat dissipation needs of current data centers,and efficient boiling heat exchange technology has begun to be applied to the heat dissipation system of data centers.In order to further enhance boiling heat transfer,this paper designed a staggered fin surface,studied the influence of the fin structure on the rewetting of the working fluid and bub-ble coalescence and detachment.This work also analyzed the behavioral characteristics of bubble groups and test the influence of fin structural parameters on boiling heat transfer.Experimental results show that the staggered arrangement of fins enhances the replenishment capacity of the liquid phase,delays the drying out of the surface,and increases the critical heat flux to 44.45 W/cm2,an increase of 100.4%of that of the smooth surface.When the spacing is 0.5 mm,the op-timal boiling heat transfer coefficient can be obtained at 2.50 W/(cm2·K),with an improvement of 229%.The results of this study provide guidance for the design of boiling phase change heat surface structures.
lectronic coolingpool boilingribenhanced heat transfer