TSV结构特征对微通道热沉性能的影响
The Impact of TSV Structural Features on the Performance of Microchannel Heat Sinks
安浩 1李家栋 1巩亮1
作者信息
- 1. 中国石油大学(华东)新能源学院,青岛 266580
- 折叠
摘要
硅通孔(Through Silicon Via,TSV)结合层间微通道冷却技术是解决高热流密度三维集成电路(Three-Dimensional Integrated Circuit,3-D IC)散热问题的有效手段.基于数值模拟研究了多种TSV针肋截面形状以及纵横比的微通道流动换热过程,综合评价了 TSV结构对流动换热性能的影响.结果表明,TSV针肋对于流场的扰动作用抑制了热边界层的发展,有效降低了芯片平均温度;针对顺排结构,纵横比为0.93的圆形截面TSV综合性能最优,综合性能评价因子(Performance Evaluation Criteria,PEC)为1.14;在错排结构中,纵横比为1.00的三角形截面TSV综合性能最优,PEC为1.24.研究结果为微通道热沉的设计制造提供了理论依据.
Abstract
Through Silicon Via(TSV)combined with interlayer microchannels are an effective ap-proach for heat dissipation of the three-dimensional integrated circuit(3-D IC)at high heat fluxes.Numerical simulations are performed to investigate the flow and heat transfer processes in microchan-nels with different cross-sectional shapes and aspect ratios of TSV pin-fins.The influence of TSV structures on thermohydraulic performance was evaluated.The results show that the TSV pin-fins disrupt the flow field and inhibit the development of the thermal boundary layer.As a result,the heat transfer in microchannels is enhanced,leading to a reduction in the average temperature of the chip.For the in-line arrangement,the circular cross-sectional TSV with an aspect ratio of 0.93 has the optimal overall performance,with a Performance Evaluation Criteria(PEC)value of 1.14.In the case of the staggered structure,the triangular cross-section TSV with an aspect ratio of 1.00 demonstrates the most favorable performance,yielding a PEC value of 1.24.The findings provide a theoretical basis for the design and manufacture of microchannel heat sinks.
关键词
微通道/三维集成电路(3-D/IC)/硅通孔(TSV)/针肋/流动传热Key words
microchannel/three-dimensional integrated circuit(3-D IC)/through silicon vias(TSV)/pin-fin/flow and heat transfer引用本文复制引用
基金项目
国家自然科学基金项目(52276090)
中国博士后科学基金项目(2023M733877)
出版年
2024
NETL
NSTL
万方数据