The Impact of TSV Structural Features on the Performance of Microchannel Heat Sinks
Through Silicon Via(TSV)combined with interlayer microchannels are an effective ap-proach for heat dissipation of the three-dimensional integrated circuit(3-D IC)at high heat fluxes.Numerical simulations are performed to investigate the flow and heat transfer processes in microchan-nels with different cross-sectional shapes and aspect ratios of TSV pin-fins.The influence of TSV structures on thermohydraulic performance was evaluated.The results show that the TSV pin-fins disrupt the flow field and inhibit the development of the thermal boundary layer.As a result,the heat transfer in microchannels is enhanced,leading to a reduction in the average temperature of the chip.For the in-line arrangement,the circular cross-sectional TSV with an aspect ratio of 0.93 has the optimal overall performance,with a Performance Evaluation Criteria(PEC)value of 1.14.In the case of the staggered structure,the triangular cross-section TSV with an aspect ratio of 1.00 demonstrates the most favorable performance,yielding a PEC value of 1.24.The findings provide a theoretical basis for the design and manufacture of microchannel heat sinks.
microchannelthree-dimensional integrated circuit(3-D IC)through silicon vias(TSV)pin-finflow and heat transfer
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