Thermal Expansion Coefficient of Cu/Graphene Nanocomposite by Molecular Dynamic Simulation
With the development and increased integration of electronic devices,the internal heat issues have become increasingly severe.During thermal cycling,the mismatch in thermal expansion coefficients of materials can generate significant thermal stress,leading to a series of thermal relia-bility problems.Regulating the thermal expansion coefficients of materials is crucial for improving the thermal issues in electronic devices.In this work,molecular dynamics simulation was used to investigate the thermal expansion coefficient of Cu/Graphene composites.It shows that the intro-duction of graphene effectively reduces the thermal expansion coefficient of the Cu-based material,and the randomly distributed doping exhibits isotropy.The Cu/Graphene nanocomposite with ori-ented doping exhibits anisotropy,which is attributed to the close arrangement and strong bonding forces between graphene layers,effectively limiting the expansion of the copper matrix.Compared to the In-plane direction,the Through-plane direction has a lower thermal expansion coefficient and elastic modulus.
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