Optimization Study on Manifold Layer of a Double Layer Pin-Fin Manifold Microchannel Heat Sink
The manifold microchannel heat sink has a compact structure and high heat transfer efficiency,which is expected to become an effective means of thermal management for high-power electronic components.In order to further improve the heat transfer capacity and temperature uniformity of the double-layer Pin-Fin manifold microchannel heat sink,this paper designs the manifold layer of the double-layer Pin-Fin manifold microchannel heat sink and conducts numerical simulation research on the flow and heat transfer characteristics of the heat sink using deionized water as the working fluid.The results show that by changing the arrangement of the inlet and outlet of the manifold layer to make the working fluid flow in opposite directions in the upper and lower microchannel layers,the thermal resistance and the surface temperature difference of the heat sink can both be reduced.Compared with horizontal inlet,vertical inlet can reduce thermal resistance and improve the comprehensive heat transfer performance of heat sink.When the inlet and outlet diameter ratio is 1,the surface temperature difference of the heat sink is maximum.When the inlet and outlet diameter ratio is less than 1,the thermal resistance decreases.However,when the inlet and outlet diameter ratio is greater than 1,the heat transfer capacity is not significantly different from that when it is equal to 1.
manifold microchanneldouble-layer microchannelpin-finenhanced heat transfer
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