Simulation of RTM process and void defect for CFRP flat plate based on PAM-RTM
Different process parameters during resin transfer molding(RTM)molding have a great influence on the quality and performance of carbon fiber reinforced resin-based composite(CFRP)components.In order to accurately design the RTM molding parameters,reduce the void defect content of the final components,and analyze the changes of two-scale void content during the mold filling process and the distribution law in the components,the mold filling and two-scale void formation of CFRP flat plate model RTM molding were simulated based on PAM-RTM software.The influence of different resin viscosity and injection pressure on the filling time,macro and micro void distribution and content were analyzed.The transverse axes at different positions in the components were selected and the macro/micro void content was compared and characteristics on the axes to analyze the change rule of void content with the change of the position from the injection port were distributed.The results show that,under the condi-tion of constant pressure injection,the higher the injection pressure,the lower the resin viscosity and the shorter the filling time;when the resin viscosity is 0.1 Pa·s and the injection pressure is 1.5 MPa,the mold filling time is the smallest,which is 13.11 s.The macro void content decreases with the increase of injection pressure,while the micro void content is the opposite.Macro void is formed after a period of time at the beginning of filling,and void content finally reaches the maximum value at the outlet.Micro void is formed at the initial stage of filling,and void content gradually decreases with the increase of filling distance.The trends of the two scales of void content on the three transverse axes are similar,the injection pressure affects the location of the beginning of the formation of macro void and the end of the formation of micro void,and affects the maximum macro void content at the end of filling,and the maximum micro void content at the beginning of filling.
resin transfer moldingdouble-scale void modelvoid defectPAM-RTM softwarenumerical simulation
NETL
NSTL
万方数据
