Preparation and properties of PI photosensitive dry film
In order to develop a kind of polyimide(PI)photosensitive dry film with high resolution and excellent mechanical properties,alkali-soluble PI resin was synthesized by using 4,4'-diphenyl ether dianhydride(ODPA)and 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane(BAHF).The photosensitive polyimide adhesive was prepared by mixing the resin with cross-linking agent,initiator and coupling agent.Finally,the photosensitive polyimide was coated on the carrier polyethylene terephthalate(PET)film,after drying,cooling,coated with polyethylene(PE)film,polyimide photosensitive dry film was obtained.The proper-ties of alkali-soluble polyimide resin and photosensitive dry film were characterized by gel permeation chromatography,Fourier transform infrared spectroscopy and microscope.The results show that alkali-soluble polyimide resin is successfully prepared,and the imidization rate is 82%.The PI photosensitive dry film with a thickness of 15μm shows excellent resolution after exposure and development.The mechanical properties,heat resistance and drug resistance of photosensitive dry film cured at 200℃are studied by dynamic thermomechanical analysis and thermogravimetric analysis.The results show that the tensile strength of the film cured at 200℃reaches 101 MPa at 30℃,the elongation at break reaches 7.3%,the thermal weight loss temperature of 5%is 352℃,the thermal weight loss temperature of 10%is 385℃,and the quality retention rate of the film at 590℃is 44%.The mass change rates in acetone,N-methylpyrrolidone,30%HNO3,30%H2SO4 or 1%HF are all less than 1%.In summary,the photosensitive dry film has excellent resolution,thermal stability and drug resistance.
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